I ran a 10min O2 clean followed by a 10min seasoning. Both went through without a problem. I then tried etching my device wafers and it failed to etch with the exact same alerts as before. I was able to pump to base and retrieve my wafer and tried a second time. This time the wafer failed leak test (30mtorr/min leak rate when limit is 25). I am currently processing another device wafer which seems to be etching fine so far (about 5mins into the etch) but the leak rate is still a bit on the higher side at 16 mtorr/min.
The wafer that got stuck in the chamber 2 days ago has a circle of charred material on the backside. Acetone doesn't remove this material.
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