The PM was completed. The chamber leak rate is now below 1um/min. Note this leak rate is different then the He leak rate report at the bottom lt hand corner for each run. My measurement of the peak wafer temperature after a specified plasma run is not as low as before the PM. At the wafer center the measured peak temperature was between 54 and 60 C. It is now between 66 and 71C. We think the problem was cause by a damage indium gasket which is on order. It will be replaced once it comes in. Note the the STS spec for the tool is a peak temp of below 77C.
I will doing further characterization over the next week. In the mean time the tool will be taken off shutdown.
Jim
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